Dr. Ajay Kumar

Back to Faculty Dr. Ajay Kumar Department of ECE Guest Faculty [email protected] 8544762241 Indian Institute of Information Technology, Kota SPL-269, RIICO Industrial Area, Kuber Extension, Ranpur, Kota – 325003, (Rajasthan, India) Google Scholar Qualifications B.Tech. (Dr. A.P.J.Abdul Kalam Technical University Lucknow, UP) M.Tech. (NIT Hamirpur, HP) Ph.D. (NIT Hamirpur, HP) Research Interests Three Dimensional-Integrated Circuits (3D-ICs) and Circuit modelling for low-power nanoscale IC design in VLSI domain, vertical interconnects, Vias (vertical interconnects access) such as Through glass vias (TGVs) and Through silicon vias (TSVs). Other Notable Information Qualified GATE 2017 and GATE 2019 in EC discipline Publications Journals Ajay Kumar and Rohit Dhiman, “Signal integrity analysis of tapered through packaging multibit glass vias using exponential matrix – rational approximation technique,” IEEE Transactions on Components, Packaging and Manufacturing Technology, 20 March, 2025, DOI: 10.1109/TCPMT.2025.3553362 (Early Access). Ajay Kumar and Rohit Dhiman, “Frequency response and transient analysis of through glass packaging vias using matrix-rational approximation (MRA) technique for three-dimensional ICs,” Microelectronics Journal, vol. 141, October 2023. https://doi.org/10.1016/j.mejo.2023.105941. Ajay Kumar, Rajeevan Chandel, and Rohit Dhiman, “Proposal and analysis of carbon nanotube based differential multibit through glass vias,” Microelectronics Journal, vol. 126, August 2022. https://doi.org/10.1016/j.mejo.2022.105500. Yachana Arora, Ajay Kumar, Rajeevan Chandel, and Rohit Dhiman, “Modeling of differential multibit through- glass-via for 3D integration,” IETE Journal of Research, 16 March 2025, https://doi.org/10.1080/03772063.2025.2476748. Vandana Boora, Ajay Kumar, Kommukuri Madhukiran, Rajeevan Chandel, and Rohit Dhiman, “Electrical characterization and performance analysis of coaxial through-glass vias,” Sādhanā, vol. 49, no. 44, pp. 1-5, January 2024. https://doi.org/10.1007/s12046-023-02392-w. Conferences Ajay Kumar and Rohit Dhiman, “Modeling and analysis of Cu-CNT composite through glass vias in 3D ICs,” Proceedings IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), URBAN, IL, USA, Dec. 2021, pp. 1-3. DOI: 10.1109/EDAPS53774.2021.9656970. Ajay Kumar and Rohit Dhiman, “Tapered differential multibit through glass vias for three-dimensional integrated circuits,” Proceedings IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), URBAN, IL, USA, Dec. 2022, pp. 1-3. DOI: 10.1109/EDAPS56906.2022.9995142. Ajay Kumar and Rohit Dhiman, “Differential multi-bit through glass vias for three-dimensional integrated circuits,” Proceedings International Symposium on VLSI Design and Test (VDAT), IIT Jammu, India, July 2022, pp. 1-6. https://doi.org/10.1007/978-3-031-21514-82. Ajay Kumar and Rohit Dhiman, “Analytical time-domain models for the analysis of tapered differential multibit TGVs for 3D ICs,” Proceedings IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), Rose-Hill, Mauritius, December 2023, pp. 1-3. DOI:10.1109/EDAPS58880.2023.10468479.

  • Dr. Ajay Kumar
  • Qualifications
  • Research Interests
  • Other Notable Information
  • Publications
  • Journals
  • Conferences

Back to Faculty Dr. Ajay Kumar Department of ECE Guest Faculty [email protected] 8544762241 Indian Institute of Information Technology, Kota SPL-269, RIICO Industrial Area, Kuber Extension, Ranpur, Kota – 325003, (Rajasthan, India) Google Scholar Qualifications B.Tech. (Dr. A.P.J.Abdul Kalam Technical University Lucknow, UP) M.Tech. (NIT Hamirpur, HP) Ph.D. (NIT Hamirpur, HP) Research Interests Three Dimensional-Integrated Circuits (3D-ICs) and Circuit modelling for low-power nanoscale IC design in VLSI domain, vertical interconnects, Vias (vertical interconnects access) such as Through glass vias (TGVs) and Through silicon vias (TSVs). Other Notable Information Qualified GATE 2017 and GATE 2019 in EC discipline Publications Journals Ajay Kumar and Rohit Dhiman, “Signal integrity analysis of tapered through packaging multibit glass vias using exponential matrix – rational approximation technique,” IEEE Transactions on Components, Packaging and Manufacturing Technology, 20 March, 2025, DOI: 10.1109/TCPMT.2025.3553362 (Early Access). Ajay Kumar and Rohit Dhiman, “Frequency response and transient analysis of through glass packaging vias using matrix-rational approximation (MRA) technique for three-dimensional ICs,” Microelectronics Journal, vol. 141, October 2023. https://doi.org/10.1016/j.mejo.2023.105941. Ajay Kumar, Rajeevan Chandel, and Rohit Dhiman, “Proposal and analysis of carbon nanotube based differential multibit through glass vias,” Microelectronics Journal, vol. 126, August 2022. https://doi.org/10.1016/j.mejo.2022.105500. Yachana Arora, Ajay Kumar, Rajeevan Chandel, and Rohit Dhiman, “Modeling of differential multibit through- glass-via for 3D integration,” IETE Journal of Research, 16 March 2025, https://doi.org/10.1080/03772063.2025.2476748. Vandana Boora, Ajay Kumar, Kommukuri Madhukiran, Rajeevan Chandel, and Rohit Dhiman, “Electrical characterization and performance analysis of coaxial through-glass vias,” Sādhanā, vol. 49, no. 44, pp. 1-5, January 2024. https://doi.org/10.1007/s12046-023-02392-w. Conferences Ajay Kumar and Rohit Dhiman, “Modeling and analysis of Cu-CNT composite through glass vias in 3D ICs,” Proceedings IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), URBAN, IL, USA, Dec. 2021, pp. 1-3. DOI: 10.1109/EDAPS53774.2021.9656970. Ajay Kumar and Rohit Dhiman, “Tapered differential multibit through glass vias for three-dimensional integrated circuits,” Proceedings IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), URBAN, IL, USA, Dec. 2022, pp. 1-3. DOI: 10.1109/EDAPS56906.2022.9995142. Ajay Kumar and Rohit Dhiman, “Differential multi-bit through glass vias for three-dimensional integrated circuits,” Proceedings International Symposium on VLSI Design and Test (VDAT), IIT Jammu, India, July 2022, pp. 1-6. https://doi.org/10.1007/978-3-031-21514-82. Ajay Kumar and Rohit Dhiman, “Analytical time-domain models for the analysis of tapered differential multibit TGVs for 3D ICs,” Proceedings IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), Rose-Hill, Mauritius, December 2023, pp. 1-3. DOI:10.1109/EDAPS58880.2023.10468479.